The plasma cutting system HiFocus 600i neo sets new standards for plasma cutting: materials with a thickness from 0.018 to 6 inch can be cut precisely. Furthermore the system is suited for marking, bevel and underwater cutting. Consisting of two power sources (HiFocus 360i neo, power module HiFocus 600i neo) the system achieves a maximum cutting current of 600 A and can be adapted to guiding systems. With HiFocus neo the user benefits, compared to competitors, from higher speed when cutting and marking electrically conductive materials, ensuring at the same time excellent quality and low process costs. Thanks to the optimised technology, the consumables are handled gently and the plasma cutting process is more efficient. The plasma cutting system HiFocus 600i neo uses the approved Contour Cut technology for cutting contours, holes and webs fast and precisely in mild steel.